Chemical Composition
| Element | Weight % |
|---|---|
| Copper | Bal. |
| Chromium | 0.5 - 1.0 |
| Zirconium | 0.02 - 0.2 |
| Iron | <0.15 |
| Silicon | ≤0.10 |
| Oxygen | ≤0.10 |
| Nitrogen | ≤0.05 |
Mechanical Properties
| Heat treatment | ||
| Yield strength | ≥420 MPa | |
| Tensile strength | ≥520 MPa | |
| Elongation | ≥20.0 % | |
| Electroconductibility | ≥85.0 % | |
| Thermal conductivity | Room temperature | 100 ℃ |
| ≥280 W/(mK) | ≥300 W/(mK) | |
Morphology
| Particle size distribution | ||
|---|---|---|
| D10 | D50 | D90 |
| ≥15 µm | 30 - 40 µm | ≤60 µm |
| Sphericity | ≥0.9 | |
| Packing density | ≥4.4 cm³ | |
| Packing density | ≥5.2cm³ | |
| Flowability | ≤22 s/50g | |
